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 ZNI1000 Temperature sensor
Description
The ZNI1000 is a Ni thin film Resistance Temperature Detector (RTD), specified to DIN 43760. The high temperature coefficient offers higher signal outputs than other RTD's, which results in higher accuracy with smaller temperature changes.
Features
* * * * Resistance at 0C: 1000 Nickel temperature detector Specified to DIN 43760 SOT23 package
Applications
* * * * Automotive electronic Circuit protection Temperature compensation Temperature measurement
Ordering information
1
Device ZNI1000TA ZNI1000TC Reel size (inches) 7 13 Tape width (mm) 8 8 Quantity per reel 3,000 10,000 Device marking ZNI ZNI
3 2 Pinout - top view
Pin 1 - Ni1000 Pin 2 - Ni1000 Pin 3 - Need a good thermal contact for short response time
Issue 5 - June 2007
(c) Zetex Semiconductors plc 2007
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ZNI1000
Absolute maximum ratings
Parameter Continuous current(a) Total power dissipation Operating temperature range Storage temperature range Symbol ICC PTOT TA Tstg Limit 5 20 -55 to +150 -55 to +150 Unit mA mW C C
NOTES: (a) Limited by operating temperature [ ICC (20mW/R)1/2 , R=func(TA)=718 to 1986 ].
Recommended operating conditions
Symbol Parameter IMDC Steady state measurement current(b) Min. 0,1 Typ. 1,2 Max. 3,0 Unit mA
NOTES: (b) limited by self heating effects (recommended current range 0,1 to 1,5mA) [ typ. case temperature error T= (R 1,2mA 1,2mA)/1,7mW/K 1,7K ] [ worst case temperature error T= (1,986k 3,0mA 3,0mA)/1,4mW/K = 13,8K ].
Electrical characteristics
Symbol Parameter R0 R25 R100 Resistance 0C Resistance 25C Resistance 100C Tolerance class B(d) Tolerance class B(d) R Long Term stability: Conditions T=0C, IM<1mA T=25C, IM = 3mA(c) T=100C, IM <1mA -55 to 0C 0 to 150C 1000h at 150C Min. 1100 Typ. 1000 1141 1618 (0.4+0.028 x |T|) (0.4+0.007 x |T|) 0.1 Max. 1200 C C % Unit
NOTES: (c) Measured under pulse conditions. (d) See ZNI1000 Tolerance class figure.
Issue 5 - June 2007
(c) Zetex Semiconductors plc 2007
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ZNI1000
Characteristics according to DIN43760
Resistance at a given temperature R0 T A Resistance at 0C Temperature in C 5.485 x 10-3 B C D 6.650 x 10-6 2.805 x 10-11 -2.000 x 10-17
R(T) = R0 x (1 + A x T + B x T2 + C x T4+ D x T6)
Formula for temperature at a given resistance T(R) = A + B x 1 + C x R + D x R + E x R coefficients: A = -412.6 B = 140.41 C = 0.00764 D = -6.25 x 10-17 E = -1.25 x 10-24 Self heating For accurate temperature measurement it's recommended to choose a small current in order to avoid self heating of the resistor. The temperature failure caused by the measurement current can be calculated with: T = P/EK where P = I * R is the heat power caused by the measurement current and EK is the self heating coefficient. The self heating coefficient for the Ni1000-SOT is: EK = (1.7 0.3) mW/K (Air: 23C; no air flow).
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Issue 5 - June 2007
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ZNI1000
Issue 5 - June 2007
(c) Zetex Semiconductors plc 2007
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ZNI1000
Package outline - SOT23
E
e b 3 leads e1
L1
E1
D
A A1 L c
Dim. A A1 b c D e
Millimeters Min. 0.01 0.30 0.085 2.80 Max. 1.12 0.10 0.50 0.20 3.04 -
Inches Min. 0.0004 0.012 0.003 0.110 Max. 0.044 0.004 0.020 0.008 0.120
Dim. e1 E E1 L L1 -
Millimeters Min. 2.10 1.20 0.25 0.45 Max. 2.64 1.40 0.60 0.62 1.90 NOM
Inches Min. 0.083 0.047 0.0098 0.018 Max. 0.104 0.055 0.0236 0.024 0.075 NOM
0.95 NOM
0.037 NOM
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
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ZNI1000
Definitions Product change Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user's application and meets with the user's requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract, tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use of these circuit applications, under any circumstances. Life support Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Terms and Conditions All products are sold subjects to Zetex' terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement. For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office. Quality of product Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer. To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our regionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels. ESD (Electrostatic discharge) Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices. The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time. Devices suspected of being affected should be replaced. Green compliance Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding regulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce the use of hazardous substances and/or emissions. All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with WEEE and ELV directives. Product status key: "Preview" Future device intended for production at some point. Samples may be available "Active" Product status recommended for new designs "Last time buy (LTB)" Device will be discontinued and last time buy period and delivery is in effect "Not recommended for new designs" Device is still in production to support existing designs and production "Obsolete" Production has been discontinued Datasheet status key: "Draft version" This term denotes a very early datasheet version and contains highly provisional information, which may change in any manner without notice. "Provisional version" This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. "Issue" This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and without notice. Zetex sales offices Europe Zetex GmbH Kustermann-park Balanstrae 59 D-81541 Munchen Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@zetex.com Americas Zetex Inc 700 Veterans Memorial Highway Hauppauge, NY 11788 USA Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 usa.sales@zetex.com Asia Pacific Zetex (Asia Ltd) 3701-04 Metroplaza Tower 1 Hing Fong Road, Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com Corporate Headquarters Zetex Semiconductors plc Zetex Technology Park, Chadderton Oldham, OL9 9LL United Kingdom Telephone: (44) 161 622 4444 Fax: (44) 161 622 4446 hq@zetex.com
(c) 2007 Published by Zetex Semiconductors plc
Issue 5 - June 2007
(c) Zetex Semiconductors plc 2007
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